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ESALROD Sponsors Copper Cladding Conference 2025

31 march 2025 Foto noticia

Join us from April 15-17 as we engage with industry leaders and showcase our latest innovations.

ESALROD is pleased to announce its participation as a sponsor at the Copper Cladding Conference 2025, taking place from April 15-17. This event represents a unique opportunity to engage with leading professionals and experts in the field of copper cladding technology.

The Copper Cladding Conference is a prestigious event that focuses on the education and awareness of topics concerning the bimetallic-conductor industry. It is an ICC (International Code Council) CEU (Continuing Education Unit) event, providing valuable insights and hands-on learning experiences from some of the industry's most respected subject-matter experts. Attendees will have the opportunity to earn CEU credits and participate in discussions on the latest advancements and applications in copper cladding technology.

With over 20 years of experience in the U.S. market, ESALROD has developed a deep understanding of the industry, offering customized solutions for the electrical sector. Our product catalog is continuously evolving to meet the changing needs of our clients. A recent example of this innovation is the launch of our product with a 22-millimeter diameter.

We invite all interested parties to join us at this prestigious event to explore advancements in the industry and establish valuable connections.

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